Siemens 6ES7195-7HC00-0XA0 SIMATIC DP Bus Module

The Siemens 6ES7195-7HC00-0XA0, also cataloged as the SIMATIC DP Bus Module, operates as a dedicated hardware component for hot-swap functional routing within ET 200M distributed I/O network platforms.

Technical Note on Model Correction: While legacy user documentation may occasionally conflate this footprint with other compact lines, the official Siemens engineering ledger registers the 6ES7195-7HC00-0XA0 strictly as an ET 200M Active Bus Module designed to hold an 80 mm wide S7-300 / ET 200M I/O module for removal and insertion functions under voltage.

Hardware Specifications

I/O Density Scaling and Firmware Flash Compatibility

The active bus module establishes the underlying physical and electrical rail configuration required to enable the "removal and insertion" (hot-swap) capability across distributed nodes. By configuring consecutive active bus modules onto a standard DIN rail rail, the architecture segments backplane power and communication channels independently for each module slot. This localized bus isolation ensures that pulling an 80 mm module does not disrupt internal backplane bus communication velocity indexes or drop current tokens on adjacent active nodes. This framework remains fully transparent to the upstream controller, preserving real-time loop execution speeds across dense I/O configurations.

Frequently Asked Questions

Q: Can the 6ES7195-7HC00-0XA0 bus module be combined with standard non-active U-shape bus connectors in the same ET 200M rack?

A: No. Active bus modules require a specialized BM (Bus Module) profile rail. They cannot be mixed or interconnected with standard S7-300 U-shape backplane connectors within the same structural rack line. The entire rack segment must be configured using active bus modules to maintain backplane bus continuity.

Q: What happens to the downstream I/O modules on the same active bus rail when a single 80 mm module is pulled for maintenance?

A: The underlying active circuitry passes backplane signals through an integrated bypass bus layer. Downstream and upstream modules continue to communicate with the IM 153 interface module without interruption, provided the hot-swap limits specified in the STEP 7 or TIA Portal hardware manager are not exceeded.

Field Installation Guidelines

• Active Rail Seating: Hook the top edge of the 6ES7195-7HC00-0XA0 onto the dedicated active bus module DIN rail, then swing it downward until the lower locking mechanism snaps firmly over the lower lip.
• Side-by-Side Interlocking: Slide adjacent bus modules together sideways along the rail track to engage the integrated lateral backplane bus pins before snapping them into permanent mechanical alignment.
• Module Shield Verification: Ensure the grounding contact springs on the rear of the active bus module sit securely against the unpainted, conductive grounding surfaces of the active rail to maintain low-impedance common-point grounding.